GAM 70 Solder Paste Thickness Measurement
● Ideal inspection for solder paste thickness, including fine pitch, for enhanced printing technology and high precision requirements.
● Detects various kinds of printing defect such as bridging, deviation location, etc
● Laser vision measurement, non-contact and non-damaging
● Statistical charts and process capability index provided as the real-time data for quality control.
● Easy to operate, fast gathering and printing of data for reference and quality control.
● Measure printed solder thickness, height, length and interval.
● Providing various kind of statistical charts, such as the distributive thickness
chart, -R control chart
● Process capability index: Cp, Cpm ,Cpk for reference
● Analyze thickness of solder cross-section, area and volume.
● Inspect length and thickness for other kinds of materials.
● Printed solder and copper.
Printing For Control Chart
● -R control chart.
● Cp, Cpk, Cpm capability index.
Operation And Measurement
● Display image full screen.
● Easy to sample.
● Easy to operate with Windows interface
● Real-time statistic
Distributive Thickness Chart
● Display and print the distributive thickness chart.
● Display and print all statistics.
● Analyses the percentage for distributive thickness.
4.55mm x 3.50 mm
350W x 265L mm
15" LCD Monitor
IBM compatible interface
Color CCD Lens
Circular LED Lighting
Micro-adjustable focus device
110VAC, 60Hz / 220VAC, 50Hz
350(L) x 400(W) x 350(H) mm
Top View (Units: mm)
Front View Lateral View
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Information contained in this data sheet is subject to change without notice
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